| 摘要 |
This invention is to provide a Cu-Ni-Si-Mg alloy in which satisfactory solder wettability, plating properties and bendability can be stably obtained. The Cu-Ni-Si-Mg based copper alloy strip is composed of a copper based alloy having a composition comprising, by mass, 1.0 to 4.5% Ni, Si in the concentration of 1/6 to 1/4 to the mass% concentration of Ni, 0.05 to 0.3% Mg, and the balance Cu with inevitable impurities, and, among inclusion groups composed of Mg oxide grains observed in the cross-section perpendicular to the rolling direction, the number of the inclusion groups with a length of ≥ 0.05 mm is ≤ 1 piece/mm<SP>2</SP>. |
