SEMICONDUCTOR IMAGE SENSOR MODULE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor image sensor module for connecting a semiconductor image sensor chip and an image signal processing chip while making minimum parasitic resistance and capacitance minimum and for simultaneously enabling the effective heat radiation and light shielding of the image signal processing chip.

SOLUTION: The semiconductor image sensor module 11 is provided with a semiconductor image sensor chip 2 and an image signal processing chip 3. On the first main surface of the semiconductor image sensor chip 2, a plurality of bump electrodes 15a are formed. A plurality of bump electrodes 15b are also formed on the image signal processing chip 3. The semiconductor image sensor chip 2 and the image signal processing chip 3 are formed by lamination via a heat radiating means 4. The plurality of bump electrodes 15a of semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.

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