| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the yield of a semiconductor device. <P>SOLUTION: The semiconductor device comprises a board 3 which has a component mounting surface bearing semiconductor chips mounted thereon and which is provided with a plurality of connection leads 3d, and a resin cap 1 which caps the component mounting surface of the board 3 and is provided with a first body and a second body 1h thicker than the first body. A production information marking 1d is made on the surface of the second body 1h of the cap 1, which eliminates a need for displaying production information by ink marking. This enables the prevention of a marking failure due to an ink blot or the like, resulting in leading to an improvement in the yield of a memory card (semiconductor device) 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
