| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise teaching precision with no labor. <P>SOLUTION: A search area which simultaneously surrounds a plurality of chips with an acquired image and a chip area which surrounds a single chip are set (S1), a chip edge representing the contour of chip is extracted by edge recognition (S2), and then a chip size is calculated from the extracted chip edge. The inside of a range which is surrounded by the chip edge is stored in a memory as a template (S6), and the chip is collated by pattern matching which aligns the template with a chip position in the search area (S7) to calculate an X pitch and a Y pitch (S8). A wafer ring is started to move in the X direction with one chip as a reference position (S9), and the movement is continued until the other chip reaches the reference position (S10). At the completion of 1 pitch feeding, a feeding amount per 1 pitch is calculated based on the moving amount (S11). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
