发明名称 |
Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types |
摘要 |
Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
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申请公布号 |
US2006105607(A1) |
申请公布日期 |
2006.05.18 |
申请号 |
US20040988220 |
申请日期 |
2004.11.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HOUGHAM GARETH G.;BUDD RUSSELL A.;CHINIWALLA PUNIT P.;COTEUS PAUL W.;LANZETTA ALPHONSO P.;LIBSCH FRANK R. |
分类号 |
H01R13/62 |
主分类号 |
H01R13/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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