FLEXIBLE PRINTED WIRING BOARD FOR COF AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board for a COF and a method of manufacturing the same whereby the reliability and productivity of a line is improved while preventing an insulating layer from being heat-sealed to a heating tool, and preventing bonding power from decreasing when a panel is mounted after a semiconductor chip is mounted.

SOLUTION: The flexible printed wiring board for the COF comprises an insulating layer 12 and a wiring pattern 21 which is formed by patterning a conductor layer 11 stacked on one surface of the insulating layer 12 and has the semiconductor chip mounted thereon. A mold releasing layer 13 formed of a mold release agent which contains an Si element containing compound is provided on the opposite surface of the insulating layer 12 from the mounted semiconductor chip. The mold releasing layer 13 has such a thickness that Si intensity detected by a wavelength dispersive X-ray fluorescence analyzer ranges from 0.15 to 2.5 kcps.

COPYRIGHT: (C)2006,JPO&NCIPI