| 摘要 |
The coating film forming apparatus (resist coating device 23a) applies processing liquid (resist liquid R) to the surface of a processed substrate (substrate G) and forms a film on it. The coating film forming apparatus comprises the first stage (stage 50), the second stage (stage 59), a processing liquid supply nozzle 51, a nozzle moving means 86, a processing liquid supply means, and a priming processing means. The first stage and the second stage are put in order and arranged, and lay a processed substrate, respectively. The processing liquid supply nozzle 51 has the dispense port of the shape of a slit prolonged in the width direction of a processed substrate. The nozzle moving means 86 moves the processing liquid supply nozzle 51. The processing liquid supply means (resist liquid source of supply 95) supplies processing liquid to the processing liquid supply nozzle 51. The priming processing means carries out equalization process of the processing liquid adhering to dispense port by rotating the roller 52, to make the processing liquid from the dispense port supply on a surrounding field of the freely rotation roller 52. The processing liquid is applied to the surface of the processed substrate laid in the first stage and the second stage by the processing liquid supply nozzle 51. |
