| 摘要 |
1,213,726. Circuit assemblies. FERRANTI Ltd. 23 Jan., 1969 [26 Jan., 1968], No.4093/88. Heading H1R. In a circuit assembly 10 comprising a plurality of electrical devices 12 mounted on a substrate 11 and interconnected by signal conductors 13 a common metal conductive member 16 is arranged parallel to and spaced from the conductors 13 so as to form matched signal transmission lines. In the -embodiment shown four silicon wafers 12 are mounted on ceramic substrate 11, conductors 13 being of gold underlaid with a nickel chromium alloy, by gold pillars 15. Metal conductive plate member 16 is provided with mounting pillars 17 at positions where the electrical interconnections between plate 16 and signal conductors 13 are required and to form the transmission lines the plate 16 is positioned over the substrate and the pillars 17 bonded to the conductors 13 or pads 18. Portion 19 is connected to earth. The assembly is completed by potting, the potting material permeating between the plate 16 and conductors 13 to form a dielectric. The externally-extending leads 14 of the assembly are also in the form of matched transmission lines since they co-operate with portion 19 of plate 16 or with leads 22. Instead of using potting compound to form the dielectric the assembly may be in an hermetically sealed container, Fig. 4 (not shown), filled with a rarefied gas. |
