发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
In a method for manufacturing a semiconductor device by processing of a wafer level, in the case of forming the semiconductor device at the wafer level, on the basis of inspection results on individual semiconductor chips constituting a semiconductor wafer, a treatment for forming a circuit including a rewiring pattern is performed with respect to a semiconductor chip judged as a conforming product and a treatment in which a rewiring pattern is not formed in order to avoid having adverse influence on a semiconductor device of a conforming product or an inspection apparatus in an inspection of a formed semiconductor device after forming the semiconductor device is performed with respect to a semiconductor chip judged as a nonconforming product. |
申请公布号 |
KR20060043142(A) |
申请公布日期 |
2006.05.15 |
申请号 |
KR20050014996 |
申请日期 |
2005.02.23 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
ITO DAISUKE;KAWAHARA TOSHIMI |
分类号 |
H01L21/66;H01L23/12 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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