| 发明名称 |
Thermal interface apparatus, systems, and fabrication methods |
| 摘要 |
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
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| 申请公布号 |
US7042729(B2) |
申请公布日期 |
2006.05.09 |
| 申请号 |
US20030608519 |
申请日期 |
2003.06.24 |
| 申请人 |
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发明人 |
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| 分类号 |
H05K7/20;H01L23/42;H01L23/433;H01L23/48 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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