发明名称 Chip light emitting diode and fabrication method thereof
摘要 A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.
申请公布号 US7042022(B2) 申请公布日期 2006.05.09
申请号 US20040754389 申请日期 2004.01.09
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 HAN KWAN-YOUNG;KIM DO-HYUNG;YANG SEUNG-MAN;LEE CHUNG-HOON;KIM HONG-SAN;PARK KWANG-IL
分类号 H01L29/22;H01L33/54;H01L27/15;H01L33/56;H01L33/62;H01L33/64 主分类号 H01L29/22
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