Embossing device has carrier plate to lower surface of which die is attached and counter plate is arranged below carrier plate whereby on upper surface of counter plate, rectangular male mold is located

摘要

The embossing device has a carrier plate (12) to the lower surface of which a die (26) is attached and a counter plate (14) is arranged below the carrier plate. On the upper surface of the counter plate, at least a rectangular male mold (34) is located. At least one die is arranged opposite to the rectangular retainer opening (44) of the opposite lying plate (22). The internal contour of the retainer opening corresponds to the outer contour of the male mold whereby the male mold is fastened to the retaining plate (38) such that it projects on the two opposite side of the male mold having lateral edge zones (46,56). Along the opposite overlaying plate, recesses (47,57) are arranged along the lateral edge zone, which extend up to the retainer opening, which engages along the side edge zone for holding safety of the male mold. An independent claim is also included for the punching device.