METHOD FOR ASSEMBLING SEMICONDUCTOR CHIPS, AND CORRESPONDING SEMICONDUCTOR CHIP ASSEMBLY

摘要

The invention relates to a method for assembling semiconductor chips, comprising the following steps: a semiconductor chip (5``) is provided that has a surface encompassing a membrane area (55`) and a peripheral area. The peripheral area is provided with an assembly area (MB) while a cavity (58') that extends all the way to the assembly area (MB) and joins an opening (58'a) there is located below the membrane area (55`); a substrate (1`; 10) is provided which has a surface with a recess (11); the assembly area (MB) of the semiconductor chip (5``) is assembled on the surface of the substrate (1`; 10) by means of a flip-chip technique in such a way that an edge (K) of the recess (11) lies between the assembly area (MB) and the membrane area (55`) while the opening (58`a) is oriented towards the substrate (1`; 10); the assembly area (MB) is filled underneath with a filling (28), the edge (K) of the recess (11) being used as a break-off area for the filling (28) such that no filling (28) penetrates into the membrane area (55); and a continuous hole (101`; 101``) is provided through the substrate (1`; 10) to the opening (58`a) of the cavity (58`). The invention also relates to a corresponding semiconductor chip assembly.