Individual chips are formed from numerous chips on a wafer by applying a mask, structuring the mask, etching troughs, applying a connection structure, and removing the wafer material

摘要

A process for producing individual chips from numerous chips (101) on a wafer (100), comprises forming a mask on the wafer, structuring the mask, etching troughs in the wafer so the bottom of the trough is below the bottom of the chip, and applying a connection structure to the chips. The wafer material is removed from the back of the wafer so the chips are only held by the connection structure.