| 摘要 |
<p>A heat sink for a semiconductor device is disclosed. The heat sink comprises a body of a heat-conducting material, which includes a three-dimensional array of interconnected chambers arranged so that fluid may pass through the body via the chambers. The body further includes a channel for a cooling medium, the channel passing through, but being closed off from, the array of interconnected chambers. The heat sink may be used, for example, in a liquid cooling system for a microprocessor.</p> |
