METHOD AND APPARATUS FOR PRODUCING CO-PLANAR BONDING PADS ON A SUBSTRATE
摘要
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
申请公布号
WO2006014894(A3)
申请公布日期
2006.05.04
申请号
WO2005US26385
申请日期
2005.07.26
申请人
K & S INTERCONNECT, INC.;MALANTONIO, EDWARD, L.;LAURENT, EDWARD;HANOON, ILAN
发明人
MALANTONIO, EDWARD, L.;LAURENT, EDWARD;HANOON, ILAN