发明名称 |
METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW |
摘要 |
A Solder bump is formed by providing solder material on a conductive site of a substrate. The solder material is reflowed to provide a solder bump on the substrate. The solder material is ultrasonically agitated during at least a part of the reflow to at least partially mitigate formation of voids in the solder bump.
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申请公布号 |
US2006091184(A1) |
申请公布日期 |
2006.05.04 |
申请号 |
US20040975774 |
申请日期 |
2004.10.28 |
申请人 |
BAYOT ART;VALERIO RICHARD |
发明人 |
BAYOT ART;VALERIO RICHARD |
分类号 |
B23K1/06 |
主分类号 |
B23K1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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