发明名称 |
Power distribution within a folded flex package method and apparatus |
摘要 |
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.
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申请公布号 |
US2006091508(A1) |
申请公布日期 |
2006.05.04 |
申请号 |
US20040977908 |
申请日期 |
2004.10.28 |
申请人 |
TAGGART BRIAN;NICKERSON ROBERT M;SPREITZER RONALD L |
发明人 |
TAGGART BRIAN;NICKERSON ROBERT M.;SPREITZER RONALD L. |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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