METHOD AND APPARATUS FOR TRANSFERRING A SOLDER DEPOT ARRANGEMENT

摘要

Disclosed area a method and an apparatus for transferring a solder depot arrangement comprising a plurality of solder depots to a connecting area arrangement of a contact surface of a substrate (36). According to the invention, a plurality of solder depots are removed from a solder depot reservoir (25) that is accommodated in a solder depot receiving device (11) by means of a singulating mechanism (12) which is embodied like a stencil and is placed above the solder depot reservoir in order to form the solder depot arrangement that is configured in accordance with the connecting area arrangement. The solder depot arrangement is then transferred to the connecting area arrangement of the substrate, the solder depot reservoir being impinged upon by negative pressure through stencil openings (15) of the singulating mechanism in order to transfer the solder depot from the solder depot reservoir to the singulating mechanism. The solder depot reservoir (25) is ventilated via a bottom wall (20) that is located opposite the singulating mechanism during impingement with negative pressure (27) through the singulating mechanism (12).