发明名称 LIFT-OFF PROCESS FOR PATTERNING FINE METAL LINES
摘要 THE PRESENT INVENTION RELATES TO A PROCESS FOR PROVIDING A PATTERN ON A SUBSTRATE FOR USE IN A METAL LIFT-OFF PROCESS, THE PROCESS COMPRISING: 1) COATING A SUBSTRATE WITH A LIQUID POSITIVE PHOTORESIST; 2) SOFT BAKING THE COATED SUBSTRATE; 3) CONTACTING THE SUBSTRATE WITH AN AQUEOUS ALKALINE DEVELOPER CONTAINING FROM ABOUT 0.005 VOLUME PERCENT TO ABOUT 0.05 VOLUME PERCENT OF AN ALKYLENE GLYCOL ALKYL ETHER; 4) PLACING A PATTERNED MASK OVER THE SUBSTRATE; 5) EXPOSING THE SUBSTRATE THROUGH THE MASK; 6) POST EXPOSURE BAKING THE SUBSTRATE; 7) OPTIONALLY, FLOOD EXPOSING THE SUBSTRATE; AND 8) DEVELOPING THE SUBSTRATE WITH AN AQUEOUS ALKALINE DEVELOPER. THE INVENTION ALSO RELATES TO A NOVEL DEVELOPER SOLUTION OF AN AMMONIUM HYDROXIDE CONTAINING FROM ABOUT 0.005 VOLUME PERCENT TO ABOUT 0.5 VOLUME PERCENT OF AN ALKYLENE GLYCOL ALKYL ETHER AND TO A PROCESS FOR PRODUCING SUCH A NOVEL DEVELOPER SOLUTION.
申请公布号 MY122595(A) 申请公布日期 2006.04.29
申请号 MYPI20000931 申请日期 2000.03.10
申请人 AZ ELECTRONIC MATERIALS (JAPAN) K.K. 发明人 RANDY D. REDD;RALPH R. DAMMEL;JOHN P. SAGAN;MARK A. SPAK
分类号 G03F7/039;G03F7/26;G03F7/16;G03F7/32;G03F7/38;H01L21/027;H01L21/28;H01L21/302;H01L21/3065;H01L21/3205 主分类号 G03F7/039
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