发明名称 METAL MESH AND WIRING PATTERN TRANSFER SHEET
摘要 PROBLEM TO BE SOLVED: To provide an independent thin wire metal mesh by a simple process, and to provide a fine wiring pattern transfer sheet capable of transferring the metal pattern of a thin film to an another support using an adhesive. SOLUTION: The independent fine wire metal mesh is obtained by plating the surface of a support having a protein-containing under coating layer with a silver fine wire lattice image formed in accordance with a silver halide diffusion transfer process by a metal, acting a liquid containing a proteolytic enzyme thereon, and peeling the plated metal fine wire lattice image from the support. The fine wiring pattern transfer sheet is capable of subjecting a similarly formed fine silver wiring pattern to electroless plating, acting a liquid containing a proteolytic enzyme thereon, and transferring the plated metal fine wiring pattern to an another support using an adhesive. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111889(A) 申请公布日期 2006.04.27
申请号 JP20040297304 申请日期 2004.10.12
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KOBAYASHI KAZUHISA
分类号 C25D1/08;C23C18/20;C25D1/20;H01B5/14;H05K9/00 主分类号 C25D1/08
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