| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which is less affected with conditioning requirements etc, temporally more stable, capable of polishing at a higher speed, more excellent in abrasive resistance, varies less in quality or performance through or among products, and is especially more excellent in planarizing capability adapted for polishing a thick conductor pattern, such as a copper wiring pattern or an aluminum wring pattern of damascene interconnect lines than a conventional polishing pad. <P>SOLUTION: A resin composition comprises 10 to 59.9 mass% thermosetting resin having no photopolymerizing functional groups, 40 to 89.9 mass% photopolymerizing monomer, and 0.1 to 10 mass% photopolymerization initiator, a liquid photosensitive resin composition is formed of the above resin composition whose components are fused and uniformly mixed together, and the polishing pad is formed of the cured material of the liquid photosensitive resin composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
