SEMICONDUCTOR PACKAGE AND METHOD TO PRODUCE THE SAME

摘要

Semiconductor package includes a rewiring substrate (3) and a semiconductor chip (2). The semiconductor chip (2) has a first face (9) with an active surface including integrated circuit devices and chip contact pads (10), a second face (14) lying in a plane essentially parallel to the first face (9) and side faces (13), each lying in a plane essentially perpendicular to the first (9) and second (14) faces. At least one edge between two mutually essentially perpendicular faces (9, 13; 14, 13) of the semiconductor chip (2) has a surface.