| 摘要 |
<p>Method for welding wafer sheets and product so obtained A method for welding wafer sheet parts along reciprocal mat- ing surfaces, in which the parts are welded to each other by the moistening of the mating surfaces and adhesion by contact of said surfaces. Moistening is preferably carried out using water alone nebulised onto the mating surfaces. The method is particularly applicable to industrial production of wafer sheet shells, formed by mating two half-shells together rim to rim.</p> |
