| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board in which a solder pad structure with excellent strength and adhesiveness is made and from which excellent adhesiveness, connectability and reliability are acquired. SOLUTION: When reflow soldering is performed, an Ni alloy layer (Cu-Ni-Sn) 68 with Ni and a solder composition metal can be made ((B) of Fig.) in the interface of a nickel layer 60 and a solder bump (Cu-Sn-Ag) 46. The bonding strength of a nickel layer and a solder bump is raised by adjusting the thickness of the Ni alloy layer 68. To regulate the thickness, a Pb layer 62 for impeding the formation of the Ni alloy layer is provided at a predetermined thickness on the Ni layer 60 ((A) of Fig.). COPYRIGHT: (C)2006,JPO&NCIPI |
