| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for surface hydrophobizing of an insulating layer, which is used for an electronic device such as a semiconductor device, a surface hydrophobizing method, a semiconductor device and its manufacturing method. SOLUTION: The composition comprises a silane compound, e.g. 1,1,3,3-tetramethoxydisilacyclobutane, bis(dimethylmethoxysilyl)methane, 1,3-dimethoxy-1,1,3,3-tetramethyldisiloxane, etc. and an organic solvent. COPYRIGHT: (C)2006,JPO&NCIPI
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