发明名称 |
METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA |
摘要 |
Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer- implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer- implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer- implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer. |
申请公布号 |
KR20060035725(A) |
申请公布日期 |
2006.04.26 |
申请号 |
KR20067000200 |
申请日期 |
2004.07.02 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORP. |
发明人 |
MARELLA PAUL FRANK;MCCAULEY SHARON;CHANG ELLIS;VOLK WILLIAM;WILEY JAMES;WATSON STERLING;KEKARE SAGAR A.;HESS CARL |
分类号 |
H01L21/027;G01N21/95;G03F1/44;G03F7/20 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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