发明名称 HIGH-FREQUENCY LAYERED PART AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object thereof is to downsize the high frequency laminated component. To achieve the object, according to the high frequency laminated component of the present invention, dielectric layer (4) whose dielectric constant is lower than that of other areas is formed around via-hole electrode (3) in a dielectric. By forming dielectric layer (4) having a low dielectric constant, electric interference between via-hole electrode (3) and circuit electrode (22) is restrained, so that the circuit electrode and the via-hole electrode can be formed more closely each other compared with a conventional one. As a result, the high frequency laminated component can be downsized. <IMAGE>
申请公布号 EP1473979(A4) 申请公布日期 2006.04.26
申请号 EP20030768136 申请日期 2003.12.22
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KUSHITANI, HIROSHI;KAMEYAMA, ICHIRO
分类号 H05K3/46;H01F17/00;H01F27/34;H01L23/12;H01L23/15;H01L23/498;H01P1/04;H05K1/02;H05K1/03;H05K1/11;H05K3/00;H05K3/02;H05K3/40 主分类号 H05K3/46
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