| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a step of treating a semiconductor with an alkali solution can be performed without corroding an aluminum pad. SOLUTION: The method for manufacturing a semiconductor device includes a step of subjecting a semiconductor wafer having an aluminum pad on one surface to a treatment with an alkali solution, wherein on treating the wafer with an alkali solution, the periphery of the surface of the semiconductor wafer 1 where the aluminum pad is formed, the side part of the semiconductor wafer, and the opposite surface of the wafer to the surface having the aluminum pad formed are covered with covering members 4a to 4c. COPYRIGHT: (C)2006,JPO&NCIPI |
