发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board without curvature capable of sufficiently suppressing the contraction of a substrate by using a mesh-shaped conductive pattern. SOLUTION: A mesh-shaped conductive pattern 5 for curvature prevention is formed in the rear surface 4 of a printed wiring board 1. The mesh-shaped conductive pattern 5 consisting of copper foil with conductivity is provided with two or more copper foil intersecting sections 6, and two or more coupling sections 7 extended from the copper foil intersecting sections 6. The mesh-shaped conductive pattern 5 is formed by connecting the copper foil intersecting sections 6 and the coupling sections 7 in a mesh shape. The mesh-shaped conductive pattern 5 is formed in the whole rear surface 4. A through hole 10 which penetrates the printed wiring board 1 is formed in a part of two or more copper foil intersecting sections 6. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108289(A) 申请公布日期 2006.04.20
申请号 JP20040291339 申请日期 2004.10.04
申请人 YAZAKI CORP 发明人 SUGITA MASAYA;KONDO KAZUAKI
分类号 H05K1/02 主分类号 H05K1/02
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