| 摘要 |
PROBLEM TO BE SOLVED: To obtain a structure of a module device capable of improving an EMC resistance, heat-dissipating properties, and mounting properties, in spite of a module resin-sealing a connector with a metallic terminal for a connection and an electronic circuit. SOLUTION: In the module device 1, the module device 1 has the connector 3 with the metallic terminal for the connection and a circuit board 2 with the mounted electronic parts 4, 5, 6, 7 and 8 and the substrate connecting side of the connector 3, the electronic parts and the circuit board 2 mounting these substrate connecting side and electronic parts are sealed with the same resin. In the module device 1, a metallic case 11 is secured to the module device 1, and the metallic case 11 and the circuit board 2 are conducted electrically. COPYRIGHT: (C)2006,JPO&NCIPI |
