An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
申请公布号
US2006081994(A1)
申请公布日期
2006.04.20
申请号
US20050038374
申请日期
2005.01.18
申请人
CRAIG DAVID M;CHEN CHIEN-HUA;HALUZAK CHARLES C;YENCHIK RONNIE J
发明人
CRAIG DAVID M.;CHEN CHIEN-HUA;HALUZAK CHARLES C.;YENCHIK RONNIE J.
