摘要 |
<p>A chip for soldering iron exhibiting extremely excellent thermal conductivity by tightly bonding plural kinds of metals having different thermal conductivity together at a level equivalent to plating. The chip for soldering iron is characterized in that a core material of a metal having a thermal conductivity higher than that of a metal constituting a bottomed tubular metallic cap is firmly fixed in the cap by thermally fusing at least a part of the core material touching the cap.</p> |