发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus, in which uniform substrate treatment is enabled by eliminating stagnation of a treatment liquid inside a treatment tank, and further, facilitating easy removal of particles. SOLUTION: In the substrate treatment apparatus, comprising a treatment tank 1 which is surrounded on four sides by side walls 2b-2e and comprising a bottomed container of which the upper portion is open, and first and second feed nozzle pipes 10a-10d for feeding the treatment liquid into the treatment tank 1, each of the first and second feed nozzle pipes 10a-10d comprises a feed nozzle pipe including a plurality of spout holes 11 arrayed in one line at predetermined intervals on the lateral side of a hollow tubular body in the lengthwise direction. Among these feed nozzle pipes in the first feed nozzle pipe (10b, 10d), its spout holes are inclined obliquely downwardly, at a predetermined angle to a horizontal direction and in the second feed nozzle pipe (10a, 10c), and its spout holes are inclined obliquely upwardly, at a predetermined angle with respect to the horizontal direction and provided approximately horizontally at predetermined intervals on one sidewall 2b of the treatment tank 1. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108512(A) 申请公布日期 2006.04.20
申请号 JP20040295337 申请日期 2004.10.07
申请人 SES CO LTD 发明人 KIZAWA HIROSHI;KOGA TAKAHIRO;NAKAMU KATSUYOSHI;OGASAWARA KAZUHISA;YAMAGUCHI HIROSHI
分类号 H01L21/304;G03F7/42;H01L21/306 主分类号 H01L21/304
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