| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board by which the residue left on a wiring pattern can be suppressed. SOLUTION: After the wiring pattern 18 is formed on a substrate 4 by using at least one kind of solution, the solution left on the substrate 4 is washed away. The washing is performed by discharging a cleaning liquid by means of an ink jet system. The solution contains an etching liquid and the formation of the wiring pattern 18 includes the patterning of a metallic film 6 provided on the substrate 4 by etching the film 6 with the etching liquid. In addition, the solution contains a plating solution, and the formation of the wiring pattern 18 includes the plating of a metallic pattern 10 provided on the substrate 4 with the plating solution. COPYRIGHT: (C)2006,JPO&NCIPI
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