| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material which has cured product characteristics such as low molding contractibility, low moisture absorbency and high temperature low elasticity and has excellent continuous molding properties such as flowability and package appearances, and to provide an electronic part device having elements sealed with the sealing epoxy resin molding material. SOLUTION: This sealing epoxy resin molding material comprises (A) an epoxy resin comprising an epoxy resin represented by general formula (I) [(n) is an integer of 0 or 1 to 10; the arbitrary hydrogen atoms on the carbon rings may be substituted with hydrocarbon groups], (B) a curing agent comprising a compound represented by general formula (II) [at least either of repeating units (a), (b), (c), (d) and (e) is contained, and (a) and/or (b) and/or (e) are contained; (j), (m), (n), (o), and (p) are each an integer of 0 to 5, provided that the sum of (j), (m), (n), (o), and (p) is 2 to 20; the arbitrary hydrogen atoms on the carbon rings may be substituted with hydrocarbon groups], (C) a mold release agent, and (D) an inorganic filler. COPYRIGHT: (C)2006,JPO&NCIPI
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