| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board in which a through-hole in a multiple structure formed into a concentric shape is utilized for forming a passive element, and also, for securing a return path of a signal or for transmitting a differential signal. <P>SOLUTION: An internal through-hole 6 and an external through-hole 7 are formed into a concentric shape so as to connect circuit patterns formed on each face of the front substrate and the rear substrate of a multilayer substrate formed by laminating a plurality of substrates, and also, to connect circuit patterns which are formed to a pair of two internal substrate faces with respect to the front substrate and the rear substrate. A filling material 8 is filled into a space between the internal through-hole 6 and the external through-hole 7. A passive element component such as a desirable capacitance component, a desirable resistance component or a desirable inductance component are formed between the through-holes 6, 7 by the selection of an interval and an area between the through-holes 6, 7 or a type of filling material 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
