| 摘要 |
PROBLEM TO BE SOLVED: To improve a carrying efficiency or a throughput in a cluster-tool processing system. SOLUTION: In the cluster-tool processing system, the wafer staying times consumed in a plurality of process modules operated concurrently in a cluster tool, e.g., PM<SB>1</SB>, PM<SB>2</SB>, PM<SB>3</SB>, PM<SB>4</SB>are set as long as the maximum one of processing times required in those process modules (i.e., the maximum processing time). Then, a vacuum carrying robot RB<SB>1</SB>of a transfer module TM so carries out a processed-off wafer W<SB>i</SB>by the pick-and-place operations performed with the access of one time to the respective process modules PM<SB>1</SB>, PM<SB>2</SB>, PM<SB>3</SB>, PM<SB>4</SB>as to carry in substitutionally a next wafer W<SB>i+1</SB>. COPYRIGHT: (C)2006,JPO&NCIPI
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