| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave demultiplexer in which first and second surface acoustic wave filter chips are mounted by a flip-chip bonding method in a package member, the isolation between the first and second surface acoustic wave filter chips is improved, and favorable attenuation characteristic is achieved. SOLUTION: A first surface acoustic wave filter chip having a low center frequency and a second surface acoustic wave filter chip 4 having a relatively high center frequency are joined to the chip-mounting surface of a package member 8. The surface acoustic wave demultiplexer comprises a structure for canceling magnetic flux that is generated by an electric signal flowing through the first surface acoustic wave filter chip, if the magnetic flux flows in an area where a signal wiring pattern and a ground wiring pattern are provided. COPYRIGHT: (C)2006,JPO&NCIPI
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