| 摘要 |
An interconnect subsystem having a sensor, at least one substrate, at least one contact assembly to said sensor and said substrate, and optionally a registration pin connected to said sensor and passing through said substrate. The contact assembly includes a guide tube, a spring within the guide tube, and a transmission tube having a contact surface and at least partially within the guide tube and forced outward by the spring, such that the contact surface contacts conductive pads on the substrate.
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