发明名称 In-situ monitoring of target erosion
摘要 A target sputtering apparatus capable of monitoring target erosion has a sputtering chamber having a sputtering target with a sputtering surface. The apparatus can have a wireless receiver to receive a wireless signal and a controller to control the receiver and components of the sputtering chamber to sputter-deposit material on a substrate, and monitor erosion of the sputtering surface of the sputtering target. The controller also has a target erosion monitoring code that includes detection wafer transport program code to transport a detection wafer onto the support in the chamber, wherein the detection wafer generates a wireless signal in relation to an extent of erosion of the sputtered surface, and erosion determination code to analyze the wireless signal received by the wireless receiver and originating from the detection wafer to determine an extent of erosion of the sputtering surface of the sputtering target.
申请公布号 US2006081459(A1) 申请公布日期 2006.04.20
申请号 US20040968367 申请日期 2004.10.18
申请人 APPLIED MATERIALS, INC. 发明人 TSAI KENNETH C.;NGAN KENNY K.
分类号 C23C14/00 主分类号 C23C14/00
代理机构 代理人
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