| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the chip scale package of a wafer level which incorporates a semiconductor device in hollow structure which cannot be easily filled with humidity, and to provide a manufacturing method. <P>SOLUTION: The semiconductor device is provided with a semiconductor substrate 1, a semiconductor device 21 of the semiconductor substrate provided in an element region 22 of one principal surface of the semiconductor substrate, a sealing member 4 provided in the one side of the principal surface for surrounding the element region, and a light transmitting member 2 stuck to the semiconductor substrate via the sealing member so as to form a hollow 7 between the element regions. A penetration hole 3 for penetrating the principal surface of the light transmitting member is provided in the light transmitting member so that the inner side opening of the penetration hole may be opened to the hollow. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
