发明名称 SEMICONDUCTOR EQUIPMENT AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide semiconductor equipment having excellent radiation characteristics for heat generated from a semiconductor device, and an electronic apparatus provided with the semiconductor equipment. <P>SOLUTION: A metal radiator plate 10 for improving the radiation characteristics for the heat generated from a heat generating member such as the semiconductor device 1 etc. is disposed on the semiconductor equipment. In further detail, the radiator plate 10 is disposed at a location corresponding to the semiconductor device 1 on the surface opposite to the semiconductor device 1 side of an insulating film 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108356(A) 申请公布日期 2006.04.20
申请号 JP20040292435 申请日期 2004.10.05
申请人 SHARP CORP 发明人 TANAKA YASUHIKO
分类号 H01L23/36;H01L21/60 主分类号 H01L23/36
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