发明名称 |
Electronic component device and manufacturing method therefor |
摘要 |
In an electronic component device, electrodes of an electric component and respective wiring lines(11,12) on a board(10A) are collectively bonded together via bumps(22) using ultrasonic vibration. The wiring lines(12) include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines(11) that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer(13) is provided inside the board(10A) in a portion below the wiring lines(11) that are substantially perpendicular to the direction of ultrasonic vibration. <IMAGE> |
申请公布号 |
EP1458018(B1) |
申请公布日期 |
2006.04.19 |
申请号 |
EP20040001572 |
申请日期 |
2004.01.26 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MAEDA, TAKENOBU |
分类号 |
H01L21/607;H01L21/60;H05K1/02;H05K3/32 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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