| 摘要 |
A freely positionable placement head ( 1 ) removes presented flip chips ( 6 ) from a wafer ( 5 ), the connection side of said chips being directed upward. The placement head has a turning device ( 9 ), in which, by the time they are placed onto a substrate ( 8 ) to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate. This makes it possible to dispense with a complex turning device assigned to the wafer ( 5 ).
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