| 摘要 |
A method for manufacturing an analysis module with accessible electrically conductive contact pads includes forming an insulating substrate with an upper surface, a microchannel(s) within the upper surface, and electrically conductive contact pad(s) disposed on the upper surface. The method also includes producing a laminate layer with a bottom surface, electrode(s) on the laminate layer bottom surface, and electrically conductive trace(s) on the laminate layer bottom surface. The method further includes adhering the laminate layer to the insulating substrate such that a portion of the bottom surface of the laminate layer is adhered to a portion of the upper surface of the insulating substrate, each electrode is exposed to at least one microchannel; and each electrically conductive trace is electrically contacted to at least one electrically conductive contact pad. Furthermore, the adhering is such that at least one surface of the electrically conductive contact pad remains exposed and accessible for electrical connection. |
