| 摘要 |
PROBLEM TO BE SOLVED: To reduce a time required for a burn-in test which is made by bringing a probe into contact with a semiconductor device. SOLUTION: The burn-in test method comprises steps of: (A) performing an operation test for first semiconductor devices (DUT1, DUT2) through probes (4, 5) provided in a probe card (1); and (B) applying stress to second semiconductor devices (DUT1', DUT2') through a second probe (6) provided in the probe card (1) for the duration of the operation test. COPYRIGHT: (C)2006,JPO&NCIPI
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