| 摘要 |
PROBLEM TO BE SOLVED: To effectively dissipate heat of a semiconductor chip to a casing and to prevent the workability of maintenance from being deteriorated. SOLUTION: A heat dissipation plate 12 for dissipating heat from the semiconductor chip comprises a resilient flat plate 121; a fixing plate 123 for fixing the flat plate 121 to the side surface of a metal casing for accommodating a substrate including the semiconductor chip, and also for serving to dissipate heat; and a metal foil 122 provided on the opposite surface of the flat plate 121 to the semiconductor chip for dissipating heat of the semiconductor chip to the casing via the fixing plate 123. COPYRIGHT: (C)2006,JPO&NCIPI
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