| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of preventing a mother board from accidentally cracking and reducing probability of burrs occurring on a wiring board when splitting, and to provide a package for storing electronic component with high accuracy of external dimensions and reliability, and an electronic device. SOLUTION: The wiring board includes the mother board 101 having a first surface 106 and a second surface 107 opposite to each other, a plurality of wiring board regions 102 formed longitudinally and laterally at the center of the mother board 101, dummy regions 103a and 103b formed along the outer periphery of the mother board 101 and between the regions 102, and splitting grooves 104a and 104b formed along the outer rim of each wiring board region 102 of the mother board 101 and in the dummy region 103b between the wiring board regions 102. The mother board 101 has a thickness of a residual part where the grooves 104a and 104b are formed thicker in the dummy region 103b between the wiring board regions 102 than on the outer rim of the regions 102. COPYRIGHT: (C)2006,JPO&NCIPI
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