| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective tape cutting method which is applicable to the case where a protective tape stuck to a surface of a semiconductor wafer is cut along a peripheral edge of the wafer, and advantageous in prevention of occurrence of foreign matter and particles due to contact between cutting edges of the protective tape stuck to the wafer surface and a redundant tape portion, and in prevention of adhesion of the foreign matter etc. to a surface of the stuck protective tape, and to provide a device implementing the method. SOLUTION: According to the protective tape cutting method, when a cutter blade 35 is thrust and penetrated into the protective tape 4 stuck to the wafer 2 to carry out cutting of the protective tape 4 by moving the cutter blade 35 along the periphery of the wafer, the interior of a protective tape cutting groove 22 is evacuated from below the groove, and an end of the redundant protective tape 4 is sucked downward and then folded. Alternatively a pressing member is pressed to a non-adhesive face of the end of the redundant protective tape 4 after cutting to fold the same downward. COPYRIGHT: (C)2006,JPO&NCIPI
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